RELIFE TK1Ceramic solder scraper

SKU
RELIFE-TK1CERAMIC-SOLDER-SCRAP
BGA reballing stencil for placing solder balls on IC chips during chip-level repair. Used with solder paste and hot air to reball chips removed from mobile phone motherboards.

En stock

13,90 €
  • Garantie 12 mois
    Pièces et main d'œuvre
  • Livraison 24/48h
    Offerte dès 100€
  • Tarif Pro
    Remises sur volume
  • Retour 30 jours
    Satisfait ou remboursé
BGA reballing stencil for placing solder balls on IC chips during chip-level repair. Used with solder paste and hot air to reball chips removed from mobile phone motherboards.
Poids
0.020 kg

Dimensions

Poids
0.020 kg
Dimensions produit (mm)
14.5*3.3*1.35

Autres

Fabricant
Relife
Rédigez votre propre avis
Vous commentez : RELIFE TK1Ceramic solder scraper
loader
Chargement en cours...

L’avis est en cours de validation.