RELIFE RL-601T 17 +

SKU
RELIFE-RL-601T-17
BGA reballing stencil for placing solder balls on IC chips during chip-level repair. Used with solder paste and hot air to reball chips removed from mobile phone motherboards.

En stock

36,90 €
  • Garantie 12 mois
    Pièces et main d'œuvre
  • Livraison 24/48h
    Offerte dès 100€
  • Tarif Pro
    Remises sur volume
  • Retour 30 jours
    Satisfait ou remboursé
BGA reballing stencil for placing solder balls on IC chips during chip-level repair. Used with solder paste and hot air to reball chips removed from mobile phone motherboards.
Poids
0.100 kg

Dimensions

Poids
0.100 kg

Autres

Fabricant
Relife
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