RELIFE RL-044 Android series chip planting tin steel stencil set/58
Description / RELIFE RL-044 Android series chip planting tin steel stencil set/58
BGA reballing stencil for placing solder balls on IC chips during chip-level repair. Used with solder paste and hot air to reball chips removed from mobile phone motherboards.
Plus d'informations
| Weight | 0.200000 |
|---|---|
| En promotion | Non |
| Paiement en plusieurs fois | Non |
| Livraison gratuite | Non |
| Assurance casse | Non |
| SAV local | Non |
| Disponibilité / Stock | Oui |
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